AOI

AGV

This equipment is used to detect defects in 8” and 12” wafer dicing lanes. It is designed for the 8” and 12” shared Chuck Table system. The Chuck Table platform can move in the XY direction and the θ-axis rotation. The vision system automatically aligns and Take an image inspection of the cutting path, and use Die’s anti-chipping belt to be invaded (Die dark crack damage) or pollution as the criterion for determining the flaw. After the flaw is confirmed and judged manually, the flaw location is recorded by Auto-Mapping and used The rate can reach more than 90%.

Purpose of usage

This equipment is used to detect defects in 8” and 12” wafer dicing lanes. It is designed for the 8” and 12” shared Chuck Table system. The Chuck Table platform can move in the XY direction and the θ-axis rotation. The vision system automatically aligns and Take an image inspection of the cutting path, and use Die’s anti-chipping belt to be invaded (Die dark crack damage) or pollution as the criterion for determining the flaw. After the flaw is confirmed and judged manually, the flaw location is recorded by Auto-Mapping and used The rate can reach more than 90%.

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